JESD22 A103 PDF

JESDAE_电子/电路_工程科技_专业资料。JEDEC STANDARD High Temperature Storage Life JESDAE (Revision of. JEDEC STANDARD High Temperature Storage Life JESDAC (Revision of JESDAB) NOVEMBER JEDEC SOLID STATE. JESD A J-STD Preconditioning (PC): PC required for SMDs only. JESD A High Temperature Storage Life (HTSL). °C for hrs.

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This test may be destructive, depending on time, temperature and packaging if any. By downloading this file the individual agrees not to charge for or resell the resulting material. During the test elevated temperatures accelerated test conditions are used without electrical stress applied.

JEDEC standards and jesf22 are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.

Mechanical damage, such as cracking, chipping, or breaking of the package, as defined in JESDB will be considered a failure, provided that such damage was not induced by fixtures or handling and it is critical to the package performance in the specific application.

For nonvolatile memories, the data specified data retention pattern must be written initially, and then subsequently verified without re-writing. Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration.

During the test, accelerated stress temperatures are used without electrical conditions applied. The high temperature storage test is typically used to determine the effects of time jssd22 temperature, under storage conditions, for thermally activated failure mechanisms and time-tofailure distributions of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms.

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If the change to a concept involves any words added or deleted excluding deletion of accidentally repeated wordsit is included. Filter by document type: Other suggestions for document improvement: During the test, accelerated stress temperatures are used without electrical conditions applied.

JESDAC__High_Temperature_Storage_Life_百度文库

Publications Department Wilson Blvd. Other suggestions for document improvement: A margin test may be used to detect data retention degradation.

Current search Search found 2 items. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed.

Some punctuation changes are not included. The electrical test measurements shall consist of parametric and functional tests specified in the applicable procurement document. For nonvolatile memories, the specified data retention pattern shall be verified before and after storage. Other conditions and durations may be used as appropriate.

Table 1 — High temperature storage conditions Condition A: JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. The devices may be 1a03 to room ambient conditions or any other defined temperature for interim electrical measurements.

If you can provide input, please complete this form and return to: Solid State Memories JC As a minimum the following items should be taken into consideration: JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes.

As a mesd22 the following items should be taken into consideration: Alternatively, application of a knowledge-based test method that reconciles use condition data JESD94 and an understanding of z103 models and failure mechanisms JEP can provide the test durations for any selected stress condition in Table 1. This test may be destructive, depending on Time, Temperature and Packaging if any.

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Standards & Documents Search

The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Cosmetic package defects and degradation of lead finish, or solderability are not considered valid failure criteria for this stress. If the change to a jexd22 involves any words added or deleted excluding deletion of accidentally repeated wordsit is included.

The electrical test measurements shall uesd22 of parametric and functional tests specified in the applicable procurement document.

Standards & Documents Search | JEDEC

If the final readpoint time window is exceeded then the units may be restressed for the same amount of time that the window is exceeded. Charge loss in Nonvolatile memories. Requirement, clause number Test method number The referenced clause number has proven to be: All comments will be collected and dispersed to the appropriate committee s.

The time window need not be met if verification data for a given technology is provided. For nonvolatile memories, the data specified data retention pattern must be written initially, and then subsequently verified without re-writing. A margin test may be used to detect data retention degradation.